JPH025374A - フレキシブルプリント基板の端子構造 - Google Patents
フレキシブルプリント基板の端子構造Info
- Publication number
- JPH025374A JPH025374A JP63155632A JP15563288A JPH025374A JP H025374 A JPH025374 A JP H025374A JP 63155632 A JP63155632 A JP 63155632A JP 15563288 A JP15563288 A JP 15563288A JP H025374 A JPH025374 A JP H025374A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- printed circuit
- flexible printed
- film
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- 229910052782 aluminium Inorganic materials 0.000 claims description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 22
- 229920003002 synthetic resin Polymers 0.000 claims description 19
- 239000000057 synthetic resin Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229920001169 thermoplastic Polymers 0.000 claims description 15
- 239000004416 thermosoftening plastic Substances 0.000 claims description 15
- 229920001225 polyester resin Polymers 0.000 claims description 13
- 239000004645 polyester resin Substances 0.000 claims description 13
- 238000004898 kneading Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000007738 vacuum evaporation Methods 0.000 claims description 2
- 229920006267 polyester film Polymers 0.000 description 26
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000002585 base Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920001646 UPILEX Polymers 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63155632A JPH025374A (ja) | 1988-06-23 | 1988-06-23 | フレキシブルプリント基板の端子構造 |
| DE68918995T DE68918995T2 (de) | 1988-06-23 | 1989-06-12 | Montage von elektronischen Bauteilen. |
| US07/365,116 US5111363A (en) | 1988-06-23 | 1989-06-12 | Mount for electronic parts |
| EP89201520A EP0347974B1 (en) | 1988-06-23 | 1989-06-12 | Mount for electronic parts |
| KR1019890008678A KR950008430B1 (ko) | 1988-06-23 | 1989-06-23 | 전자 부품용 마운트 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63155632A JPH025374A (ja) | 1988-06-23 | 1988-06-23 | フレキシブルプリント基板の端子構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH025374A true JPH025374A (ja) | 1990-01-10 |
| JPH0459751B2 JPH0459751B2 (en]) | 1992-09-24 |
Family
ID=15610229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63155632A Granted JPH025374A (ja) | 1988-06-23 | 1988-06-23 | フレキシブルプリント基板の端子構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025374A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119956U (ja) * | 1991-04-09 | 1992-10-27 | 帝国通信工業株式会社 | 電池ホルダの基板取付構造 |
| JP2017130441A (ja) * | 2016-01-20 | 2017-07-27 | Fdk株式会社 | ラミネート型蓄電素子およびラミネート型蓄電素子の実装方法 |
| CN112397107A (zh) * | 2019-08-16 | 2021-02-23 | 神讯电脑(昆山)有限公司 | 储存装置的加热及散热结构 |
-
1988
- 1988-06-23 JP JP63155632A patent/JPH025374A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119956U (ja) * | 1991-04-09 | 1992-10-27 | 帝国通信工業株式会社 | 電池ホルダの基板取付構造 |
| JP2017130441A (ja) * | 2016-01-20 | 2017-07-27 | Fdk株式会社 | ラミネート型蓄電素子およびラミネート型蓄電素子の実装方法 |
| CN112397107A (zh) * | 2019-08-16 | 2021-02-23 | 神讯电脑(昆山)有限公司 | 储存装置的加热及散热结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0459751B2 (en]) | 1992-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |